The IO Package S-parameter models represent the package interconnect between the die and BGA balls for each IO in each bank. These models can be used in place of the interconnect models present in AMD IBIS files when greater simulation accuracy is desired.   When using these models in place of the IBIS interconnect modeling, ensure to disable any options in the simulation tool that enable the IBIS interconnect.

The S-Parameter files are Touchstone 1.0 compliant.

The ports are defined as follows:

"AboveDIE" represents the connection to the ASoC die at the C4 bump
"BelowBGA" represents the connection to the BGA ball where it meets the PCB
Each IO will have one die connection and one BGA connection and share a common notation.
Example:   ...AboveDIE_10999::IO_L0N_XCC_N0P1_M0P1_700
           corresponds to
		   ...BeneathBGA_AU30::IO_L0N_XCC_N0P1_M0P1_700
		   
The IBIS driver should connect to the "AboveDIE" port, while the connection to the PCB should connect to the "BeneathBGA" port.

-------------------------------------------------
AsoC Package                                    |
                                                |												
---------------            substrate            |
|             |          interconnect           |           
|  Die/IO     |AboveDie<------------->BeneathBGA|------|        
| IBIS Driver |(C4 bump)              (BGA Ball)|      | PCB Routing   |---|
|             |                                 |      |---------------|   |
---------------                                 |                      |---|
                                                |
                                                |
-------------------------------------------------